Green Silicon Carbide is primarily produced from petroleum coke and high-quality silica through high-temperature smelting in a resistance furnace. It exhibits a green crystalline structure, is brittle and sharp, and possesses a certain degree of thermal conductivity. The Mohs hardness is as high as 9.5, with a microhardness of 3280—3400 kg/mm², second only to diamond, cubic boron nitride, and boron carbide . This high hardness allows it to easily cut into equally hard semiconductor materials (such as monocrystalline silicon and silicon carbide substrates), achieving efficient material removal.
In semiconductor applications, purity is paramount. High-quality Green Silicon Carbide micropowder can achieve a SiC content of over 99%, with Fe₂O3 content controlled at very low levels (e.g., below 0.2%) . Its stable chemical nature means it does not readily react with wafer materials, thereby reducing chemical contamination and damage during processing.
In the wafer grinding stage, Green Silicon Carbide micropowder can precisely remove tiny protrusions and the damaged layer on the silicon wafer surface. Thanks to the sharpness of its particles and controllable particle size distribution (e.g., from GC#800 to GC#8000, with D50 as fine as 1.2μm), it can significantly reduce subsurface defects while maintaining a high material removal rate, ensuring high surface finish (can reach below 2-3μm) . This provides a high-quality foundation for subsequent critical processes like photolithography and etching.
In the process of slicing ingots into wafers, traditional free abrasive slurry (FAS) cutting technology widely uses Green Silicon Carbide micropowder. The particles, driven by the cutting wire (e.g., copper wire), perform rolling and cutting actions on the ingot. The angular shape and toughness of Green Silicon Carbide ensure the flatness of the cut edge, reducing chipping and cracks, thereby improving yield rates.
For semiconductor manufacturers, cost control is a core competitive advantage. Compared to super abrasives like diamond, Green Silicon Carbide offers significant cost benefits. In rough grinding and medium-precision lapping processes, using Green Silicon Carbide can substantially reduce consumable costs while meeting process requirements. Its wear resistance ensures a long service life, reducing downtime for tool changes, thereby improving overall production efficiency.
Green silicon carbide holds a crucial position in the semiconductor wafer manufacturing industry due to its high hardness, high purity, excellent cutting ability, and cost-effectiveness. Whether for traditional free abrasive cutting or precision grinding that pursues high surface quality, green silicon carbide is the ideal choice to ensure wafer geometric accuracy and surface integrity.
